Sandia Energy > Programs > Sustainable Transportation > Vehicle Technologies > Energy Efficient Computing for Automated Vehicles (EECAV) > Energy Efficient Computing for Automated Vehicles (EECAV) Workshop Presentations DAY 1 (May 11, 2021): EECAV Workshop Welcome and Introduction Presenter: Zhiyong Li, Sandia National Laboratories This talk gives the purpose of the EECAV Workshop and the desired outcome. Download the Workshop Welcome and Introduction Overview of Semiconductor and Automated Vehicle Development Projections Presenters: Matt Marinella, Sandia National Laboratories and Jace Mogill, (USCAR) This presentation gives the landscape/projections from the semiconductor and AV industry perspectives for the next generation of technologies relevant to EECAV. Download the Semiconductor and Automated Vehicle Development Projections Overview Overview of the Roadmap Scope and Outline Presenter: Lennie Klebanoff, Sandia National Laboratories The presentation gives a discussion of the philosophy behind the Roadmap Outline (timeline and scope), as well as computational energy efficiency from the supply side (chip technology) and the demand side (vehicle implementation). Download the Overview of the Roadmap Scope and Outline DAY 2 (May 12, 2021): Introduction for Day 2 Presenter: Lennie Klebanoff, Sandia National Laboratories This presentation gives the expectations for the outcome of Day 2 of the EECAV Workshop. Download the Introduction for Day 2 Feedback Session for Technical Area I: Chips: Materials, Devices and Circuits Presenter/Moderator: John Paul Strachan, Forschungzentrum Jülich/RWTH (Aachen), formerly HPE This presentation gives a description of the R&D problems that were identified for Technical Area I: Chips: Materials, Devices and Circuits, in order to collect feedback from the workshop participants. Download the Feedback Session for Technical Area I Feedback Session for Technical Area II: Chips: Architecture, Safety and Security Presenter/Moderator: Rob Aitken, ARM Research This presentation gives a description of the R&D problems that were identified for Technical Area II: Chips: Architecture, Safety and Security, in order to collect feedback from the workshop participants. Download the Feedback Session for Technical Area II Feedback Session for Technical Area III: Algorithms and Data Management Presenter/Moderator: Robert P. Dick, University of Michigan This presentation gives a description of the R&D problems that were identified for Technical Area III: Algorithms and Data Management, in order to collect feedback from the workshop participants. Download the Feedback Session for Technical Area III Feedback Session for Technical Area IV: Sensors Data Interface Presenter/Moderator: Jace Mogill, (USCAR) This presentation gives a description of the R&D problems that were identified for Technical Area IV: Sensors Data Interface, in order to collect feedback from the workshop participants. Download the Feedback Session for Technical Area IV