The Microsystem Assembly and Brazing Facility offers advanced capabilities for epoxy die bonding, soldering, wire bonding, seam sealing, holistic packaging and materials process analysis, metal deposition (e.g., PVD, CVD, ALD), 3D printing (e.g., PEEK, Composite, FDM), laser machining, temperature cycling and aging, and PWA rapid prototyping.
The image depicts a high temperature integrated circuit wire bonded to a ceramic printed circuit board.